The information and reference system designed to provide the electronic equipment developers and manufacturers with information on technical parameters and operating characteristics of the domestically produced ECB is available in the section “Standardization”.
For more details on the IRS, see the reference.
Electronstandart: presentation of the “Work in Russia” program
The initiatives of the Counsel of young scientists and specialists of JSC “RSRI “Electronstandart” within the framework of the “Open doors week” campaign extend the frontiers.
With the support of the administration of the Gatchina district of the Leningrad region and direct participation of the recruitment and youth affairs officer, on April 24, 2017, the ”Work in Russia” program and the enterprise were presented.
The 6th - 11th graders displayed a keen interest in the career path “school - university - military-industrial complex enterprise”.
The parties agreed to keep in touch and get to know a potential work place directly at JSC “RSRI ”Electronstandart”.
With the support of the administration of the Gatchina district of the Leningrad region and direct participation of the recruitment and youth affairs officer, on April 24, 2017, the ”Work in Russia” program and the enterprise were presented.
The 6th - 11th graders displayed a keen interest in the career path “school - university - military-industrial complex enterprise”.
The parties agreed to keep in touch and get to know a potential work place directly at JSC “RSRI ”Electronstandart”.
“Petersburg electronics journal” # 1 of 2017
The journal opens with the article by I. M. Changli about the scientific adviser of JSC “RSRI “Electronstandart”, V.G. Malinin who has been working at the institute for 50 years. Valeriy Georgievich’s contribution in the domestic radio electronics development is invaluable.
The journal also contains the articles dedicated to contemporary problems of electronic material sciences, new developments and testing of electronic technology item and electronic equipment, recent trends in magnetics development.
The journal also contains the articles dedicated to contemporary problems of electronic material sciences, new developments and testing of electronic technology item and electronic equipment, recent trends in magnetics development.
Designated institution of the state customer of ECB
To implement the requirements of РЭК 05.002-2015 and РЭК 05.002/4-2015 documents, the Radioelectronic Industry Department of the Ministry of Industry and Trade of the Russian Federation has made a decision to designate JSC “RSRI “Electronstandart” to be the authorized institution of the State customer of EEE in terms of reviewing and coordination of programs and methods of EEE certification testing.
The Designated institution functions are:
- reviewing and coordination of programs and methods of EEE certification testing;
- performing expert examination of the technical justification of the selected EEE certification tests.
The Designated institution functions are:
- reviewing and coordination of programs and methods of EEE certification testing;
- performing expert examination of the technical justification of the selected EEE certification tests.
Participation in the technical seminar "Technological solutions for multilead micromodule packaging"
On April, 13, 2017, the specialist of the production department of JSC “RSRI ”Electronstandart”, S.Y. Vovk participated in the technical seminar called “Technological solutions for multilead micromodule packaging” organized by Ostec Group together with GSNanotech.
The specialists of the companies shared their experience and best practices in integral circuit packaging using the example of multilead DIMM-memory modules. The aspects of ultra-thin chips operation were discussed as well as solutions in wire bonding and IC sealing with plastic material.
The parties agreed on further contacts and collaboration in the innovative industry sector development.
More details.
The specialists of the companies shared their experience and best practices in integral circuit packaging using the example of multilead DIMM-memory modules. The aspects of ultra-thin chips operation were discussed as well as solutions in wire bonding and IC sealing with plastic material.
The parties agreed on further contacts and collaboration in the innovative industry sector development.
More details.
