On April, 13, 2017, the specialist of the production department of JSC “RSRI ”Electronstandart”, S.Y. Vovk participated in the technical seminar called “Technological solutions for multilead micromodule packaging” organized by Ostec Group together with GSNanotech.
The specialists of the companies shared their experience and best practices in integral circuit packaging using the example of multilead DIMM-memory modules. The aspects of ultra-thin chips operation were discussed as well as solutions in wire bonding and IC sealing with plastic material.
The parties agreed on further contacts and collaboration in the innovative industry sector development.
More details.
About the institute
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- Summary list for the special evaluation study of the Labor conditions
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Phone: +7 812 676-29-29
Fax: +7 812 676-29-19
Email: info@elstandart.spb.ru
